Phase change process of nanoparticle enhanced PCM in a heat storage including unsteady conduction

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dc.contributor.authorShafee A.
dc.contributor.authorSheikholeslami M.
dc.contributor.authorWang P.
dc.contributor.authorSelimefendigil F.
dc.contributor.authorBabazadeh H.
dc.date.accessioned2024-07-22T08:07:19Z
dc.date.available2024-07-22T08:07:19Z
dc.date.issued2020
dc.description.abstractThermal energy release process during solidification of water has been simulated in current investigation. Time-linked equation was solved via Galerkin approach and automatic time step has been considered. To augment thermal characteristics, NEPCM has been fabricated by embedding copper oxide in to water. Low deviation with experimental data confirms the accuracy of current code. With reduce of concentration of nanomaterial, process prolonged and higher temperature of domain has been reported. Selecting greater shape factor yields to stronger conduction mode which can result unit with lower solidification time. There was an approximate 1.34% reduction in discharging time with augment of shape factor and such percentage reaches to 4.6% for nanomaterial with 0.04 volume fraction. There is reducing tendency in time of solidification with augment of concentration of nanomaterial and outputs showed that 14.39% reduction for platelet CuO nano powders. Energy released reduces as time augments due to reduction in mass of liquid phase. © 2020 Elsevier B.V.
dc.identifier.DOI-ID10.1016/j.molliq.2020.113102
dc.identifier.issn01677322
dc.identifier.urihttp://akademikarsiv.cbu.edu.tr:4000/handle/123456789/13926
dc.language.isoEnglish
dc.publisherElsevier B.V.
dc.subjectCopper oxides
dc.subjectDigital storage
dc.subjectHeat storage
dc.subjectNanostructured materials
dc.subjectSolidification
dc.subjectConduction mode
dc.subjectCurrent codes
dc.subjectEnergy release
dc.subjectGalerkin approach
dc.subjectLow deviations
dc.subjectPhase change process
dc.subjectSolidification time
dc.subjectThermal characteristics
dc.subjectReduction
dc.titlePhase change process of nanoparticle enhanced PCM in a heat storage including unsteady conduction
dc.typeArticle

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