Dielectric properties of polystyrene/alumina composites for microelectronic devices

Baştürk S.B.; Yalamaç E.; Gültekin S.

Dielectric properties of polystyrene/alumina composites for microelectronic devices

Date

2016

Authors

Baştürk S.B.

Yalamaç E.

Gültekin S.

Publisher

European Conference on Composite Materials, ECCM

Abstract

The availability/lightness of electronic equipments in automotive, telecommunication and computer sectors have great importance in terms of the cost decrease and usability in high speed applications. Printed circuit boards (PCBs) are the main components of these systems and composed of two basic elements: substrate and passive electronic devices. Microelectronic segments having low dielectric permittivity (dielectric constant) and loss tangent minimize the capacitive coupling effects and decrease the signal attenuation. Ceramic particle filled polymer composites combine the desired dielectric properties and have been employed in electronic industry. In this study, 5%, 15% and 30% wt. alumina (Al2O3) loaded polystyrene (PS) composites were produced. The size of the PS granules was reduced below 100 microns by ball milling process. The Al2O3 and PS powders were mixed by vibratory disc mill and subjected to injection molding for manufacturing the circular specimens. The dielectric permittivity (real and imaginary parts) and loss tangent parameters of the composites were measured via dielectric analyzer up to 1 MHz at room temperature. Based on dielectric measurements, there was no pronounced difference among the samples' real part permittivities along the frequency variation. As expected, the ceramic content increase led to the increase of permittivity and 30%Al2O3 wt. loaded structure showed the maximum values. This behavior was attributed to the effect of polarization which appears in heterogeneous media consisting of phases with different dielectric constant and conductivity. © 2016, European Conference on Composite Materials, ECCM. All rights reserved.