Dielectric properties of polystyrene/alumina composites for microelectronic devices

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dc.contributor.authorBaştürk S.B.
dc.contributor.authorYalamaç E.
dc.contributor.authorGültekin S.
dc.date.accessioned2024-07-22T08:12:08Z
dc.date.available2024-07-22T08:12:08Z
dc.date.issued2016
dc.description.abstractThe availability/lightness of electronic equipments in automotive, telecommunication and computer sectors have great importance in terms of the cost decrease and usability in high speed applications. Printed circuit boards (PCBs) are the main components of these systems and composed of two basic elements: substrate and passive electronic devices. Microelectronic segments having low dielectric permittivity (dielectric constant) and loss tangent minimize the capacitive coupling effects and decrease the signal attenuation. Ceramic particle filled polymer composites combine the desired dielectric properties and have been employed in electronic industry. In this study, 5%, 15% and 30% wt. alumina (Al2O3) loaded polystyrene (PS) composites were produced. The size of the PS granules was reduced below 100 microns by ball milling process. The Al2O3 and PS powders were mixed by vibratory disc mill and subjected to injection molding for manufacturing the circular specimens. The dielectric permittivity (real and imaginary parts) and loss tangent parameters of the composites were measured via dielectric analyzer up to 1 MHz at room temperature. Based on dielectric measurements, there was no pronounced difference among the samples' real part permittivities along the frequency variation. As expected, the ceramic content increase led to the increase of permittivity and 30%Al2O3 wt. loaded structure showed the maximum values. This behavior was attributed to the effect of polarization which appears in heterogeneous media consisting of phases with different dielectric constant and conductivity. © 2016, European Conference on Composite Materials, ECCM. All rights reserved.
dc.identifier.urihttp://akademikarsiv.cbu.edu.tr:4000/handle/123456789/15931
dc.language.isoEnglish
dc.publisherEuropean Conference on Composite Materials, ECCM
dc.subjectAlumina
dc.subjectAluminum
dc.subjectAutomobile electronic equipment
dc.subjectBall milling
dc.subjectCeramic materials
dc.subjectComposite materials
dc.subjectDielectric properties
dc.subjectDielectric properties of solids
dc.subjectFilled polymers
dc.subjectInjection molding
dc.subjectMicroelectronics
dc.subjectMilling (machining)
dc.subjectPolystyrenes
dc.subjectPrinted circuit boards
dc.subjectSubstrates
dc.subjectCapacitive coupling effects
dc.subjectDielectric measurements
dc.subjectDielectric permittivities
dc.subjectFilled polymer composites
dc.subjectLoss tangent
dc.subjectMicro-electronic devices
dc.subjectPolymer/ceramic composites
dc.subjectPrinted circuit board (PCBs)
dc.subjectPermittivity
dc.titleDielectric properties of polystyrene/alumina composites for microelectronic devices
dc.typeConference paper

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